Opto-Electronics Module Hybrid Assembly/Dispensing System

OEP-520E/OED-530E series are designed for optics industry and other high‐tech packaging and assembling applications. These machines are designed for high speed assembling/dispensing requirement. With CCD alignment and part recognition function, these equipments could be applied up to more than 800 mega-pixel camera assembling or some other high accuracy application.

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• Parameter driven, line change <30min
• High speed and Small size
• CCD based auto‐calibrating module, ensures high motion accuracy
• Embedded fine placement pressure control, minimize the material damage
• Vacuum based platform prevents substrate warpage
• CCD aligning and parts recognition function
  
  
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• Lens assembling/Dispensing
• IR filter attachment
• Die attachment