FPI (Fingerprint Identification) modules are one of the most widely adopted biometric technologies in smart devices. With the continued growth in demand from smartphones, tablets, notebooks, and portable electronics, the FPI market continues to expand. Key driving factors include increasing smartphone penetration, the proliferation of personal smart devices, and rising demand for convenient yet highly secure identity authentication. Future development will increasingly rely on AI-assisted algorithms to support higher-security applications such as mobile payment, access control, and industrial control systems.

From a manufacturing perspective, FPI modules integrate optical films, sensing chips, metal rings, and FPCs, resulting in assembly processes that require extremely high precision, cleanliness, and stability. Typical processes include DAF (Die Attach Film) lamination, thermal compression bonding, film peeling, optical lens mounting, metal ring dispensing and bonding, JET valve–based underfill encapsulation, and curing. Each of these steps demands highly repeatable and accurate positioning to ensure sensing accuracy and long-term module reliability.

Automation equipment supporting FPI production includes high-precision assembly, dispensing and interpolation control, laser welding, film peeling, thermal bonding and lamination, alignment, appearance inspection (AOI), and electrical testing. By implementing a comprehensive automated manufacturing solution, manufacturers can significantly improve module yield, shorten production cycle time, and maintain consistent quality even under high-volume production conditions.