WLP (Wafer Level Packaging) is an advanced packaging technology in which the entire wafer is packaged before being singulated, resulting in a final package size close to that of the bare die. This process integrates wafer fabrication, packaging, and testing.

Typical WLP processes include front-end manufacturing, RDL (Redistribution Layer), bumping, package reinforcement, and singulation. Fan-out WLP (FOWLP) has grown rapidly due to its support for higher I/O density and improved electrical performance. The key distinction lies in die placement, where dies are rearranged onto a reconstituted wafer or mold panel, providing more routing space for RDL processes.

In WLP, Underfill (bottom fill) is crucial for enhancing solder joint reliability. Common methods include pre-reflow underfill (PAUF) and capillary underfill after reflow (CUF). Epoxy resin penetrates under the solder joints through capillary action and cures, improving mechanical stress resistance and thermal cycling life while preventing microcracks or fatigue failures.

We provide a complete WLP automation equipment solution, including high-precision die bonding/placement platforms, wafer preheating systems, underfill dispensing machines, and pre-curing equipment. These solutions support advanced packaging technologies such as FOWLP and InFO, helping customers build high-yield, stable, and mass-producible wafer-level packaging production lines.