PLP (Panel Level Packaging) is a rapidly emerging advanced packaging technology that uses large-format square panels to improve area utilization and reduce cost. With the growth of AI, HPC, and wearable device markets, mass production adoption of Fan-out PLP (FO-PLP) continues to accelerate.

The core PLP processes include die attachment, panel transfer assembly, RDL (Redistribution Layer) patterning, photoresist exposure, electroplating, and package structure formation, followed by singulation into individual ICs.

In PLP manufacturing, Underfill (bottom fill) is a critical step for ensuring solder joint reliability. By using capillary action to fill the gap between the chip and substrate with epoxy resin, mechanical strength, thermal cycling lifespan, and fatigue resistance are significantly enhanced. After thermal curing, a stable structure is formed. Due to large panel sizes and high die density, this process requires precise fluid control, uniform heating, and advanced automation capabilities.

We provide a complete PLP automation equipment solution, including high-precision die bonding and placement, Glass/SBS panel preheating, panel-level bottom fill dispensing (Underfill), and post-dispense pre-curing systems. These solutions help customers build high-yield, stable, and mass-producible PLP advanced packaging production lines.