Semiconductor packaging is the final stage after wafer fabrication, aimed at protecting the singulated dies and establishing reliable electrical connections between the chip and external circuits. Through protective casing, conductive structure design, and thermal management, packaging effectively prevents chips from moisture, heat, or mechanical stress, while ensuring signal integrity and long-term reliability. With increasing demand from AI, 5G, high-performance computing (HPC), and automotive electronics, packaging has evolved from traditional wire bonding to advanced architectures such as Flip Chip, Fan-out, 3D IC, and Chiplet, making automation precision, speed, and integration increasingly critical.

The packaging process typically includes wafer dicing, die bonding/placement, wire or bump connections (Wire Bond / Bumping / Flip Chip), molding/underfill, reconstituted wafer (Re-con), testing, and marking. Advanced packaging technologies such as FOWLP, CoWoS, and InFO emphasize integrated processes, precise alignment, material flow control, and high automation to ensure yield and consistency in mass production.

Our semiconductor packaging automation solutions cover the complete process, including high-precision die bonding/placement platforms, Re-con equipment, underfill dispensing and uniformity control systems, wafer/panel preheating and pre-curing modules, high-speed alignment platforms, chip sorting and functional testing equipment (Testing handler), precision film attachment systems, and full AOI/inspection systems. Through modular and customizable designs, we help customers build high-capacity, efficient, and high-yield advanced packaging production lines.