The Micro LED market is rapidly growing, with applications expanding from smartwatches and AR/VR wearable devices to automotive displays, transparent displays, and large commercial displays. Recent trends focus on reducing manufacturing costs, improving mass transfer yield, and enhancing full-color integration efficiency, while also exploring new non-display applications such as automotive lighting and AI optical communication. Global manufacturers are accelerating their technology deployment, making the establishment of technical leadership and equipment integration capabilities in key processes a critical factor for industry competitiveness.

From a manufacturing perspective, Micro LED production can be divided into five main stages. The first stage is chip fabrication, including epitaxy, wafer growth, and micro-LED processing. The second stage involves chip selection and mass transfer, where high-speed mechanisms and precise alignment technology are used to simultaneously transfer to mass transfer a large number of LED chips onto the backplane. The third stage is chip bonding and fixation, ensuring each chip is securely attached both electrically and mechanically. Next comes compensation, inspection, and repair, where high-resolution AOI and repair equipment are used to replace defective chips. Finally, module packaging and final product processes are performed to provide complete optical performance, heat dissipation, and protection.

In terms of equipment, our focus is on back-end packaging automation, including mass transfer, high-precision placement, defective chip repair, multi-module tiling, and related inspection technologies. These solutions help customers improve yield, stability, and mass production capability, providing a highly efficient Micro LED production line solution.