IRIS (iris) recognition, characterized by high security, non-replicability, and fast matching performance, is gradually expanding from high-end security and access control systems into mobile devices and industrial control applications, becoming one of the key trends in the biometric identification market. With AI accelerating image matching efficiency and accuracy, iris recognition modules will continue to evolve toward smaller form factors, higher resolution, and lower power consumption.

From a manufacturing perspective, iris modules integrate sensing chips, optical filters, infrared light components, and FPCs. Typical processes include Die Bonding, high-precision dispensing, optical component assembly, UV curing, and back-end inspection. Due to the compact size and dense structure of iris modules, extremely high accuracy is required for bonding and alignment processes.

Corresponding automation equipment can support high-precision Die Bonding, micro-volume dispensing, component assembly, UV curing, and automatic loader/unloader systems. These solutions help improve production yield, enable unmanned operation, shorten cycle time, and ensure stable biometric recognition performance of iris modules.