VDB600 Bonder

VDB600 are the machines with the innovation of pick-and-placement the multi-mode chips and micro components.

The technology involves the use of the automatic wafer feeding, new bond head, flip chip and dual head with independent dispensing control system and implements the placement of the high speed and accuracy.Evest provides the best solution of the automatic processes by developing and manufacturing customized and intelligent machines for the fields of the MEMS, IR LED, 3D SENSING, LENS.

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Additional information


220 volts, three phases

Rated Power Supply


Supply Air Source

0.5 ~ 0.8 MPa ,150 Liter/min

Dimension (WxLxH)(mm)

W 1.3(m) X D 1.2(m) X H1.7(m) w/o HEPA & LD/ULD)

Weight (Kg)



EVEST Standard color